1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration
1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration
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DOI：
10.1109/jlt.2020.3039218
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发表时间：
2021-02-15
影响因子：
4.7
通讯作者：
Liao, Ling
中科院分区：
文献类型：
--
作者：
Fathololoumi, Saeed;Hui, David;Liao, Ling
我们描述了高带宽密度硅光子集成电路（SiPh IC）的性能，使第一个全功能的光子引擎（PE）模块与以太网交换机共同封装。我们展示了1.6 Tbps SiPh发射器（Tx）IC，该IC在芯片上集成了支持16个106.25 Gbps PAM 4光发射通道所需的所有激光器、微环调制器、监控光电探测器、光斑大小转换器和V形槽。该SiPh Tx与分立式接收器（Rx）SiPh IC一起实现了800 Gbps PE。PE的设计允许在高带宽交换机ASIC周围共同封装多达16个模块。本文中描述的PE测试结果是使用16个53.125 Gbps电通道获得的，这些电通道被多路复用以驱动8个同时运行的106.25 Gbps光通道。我们报告DR4 IEEE标准兼容的高速光眼性能以及全链路操作。在所有通道上都证明了FEC后在温度和延长的持续时间内的无差错操作。
We describe the performance of high bandwidth-density silicon photonic based integrated circuits (SiPh ICs) that enable the first fully functional photonic engine (PE) module co-packaged with an Ethernet switch. We demonstrate the 1.6 Tbps SiPh transmitter (Tx) IC that integrates on-die all the lasers, micro ring modulators, monitor photodetectors, spot size converters, and V-grooves that are needed to support sixteen 106.25 Gbps PAM4 optical transmit channels. This SiPh Tx, together with discrete receiver (Rx) SiPh ICs, enabled an 800 Gbps PE. The PE is designed to allow up to sixteen modules to be co-packaged around a high-bandwidth switch ASIC. The PE test results described in this article were obtained using sixteen 53.125 Gbps electrical channels that were multiplexed to drive eight simultaneously operating 106.25 Gbps optical channels. We report DR4 IEEE standards compliant high-speed optical eye performance as well as full link operation. Post-FEC error-free operation over temperature and over extended time duration is demonstrated on all channels.