The Effect of Ni Plating on the Residual Stress and Micro-Yield Strength in an Al-Cu-Mg Alloy Under Different Diffusion Treatments
The Effect of Ni Plating on the Residual Stress and Micro-Yield Strength in an Al-Cu-Mg Alloy Under Different Diffusion Treatments
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不同扩散处理下镀镍对Al-Cu-Mg合金残余应力和微屈服强度的影响
DOI：
10.1007/s11837-019-03745-9
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发表时间：
2019
期刊：
影响因子：
2.6
通讯作者：
Xiaojun Zhao
中科院分区：
文献类型：
--
作者：
Yufeng Song;Xuefeng Ding;Lairong Xiao;Wenhui Liu;Yuqiang Chen;Xiaojun Zhao
铝铜镁合金具有密度低、疲劳强度高等优点，在航空航天、航海等领域具有广阔的应用前景。然而，加工后较高的残余应力和较低的微屈服强度限制了其在惯性仪表领域的进一步应用。研究了在不同扩散处理条件下，镀镍对Al-Cu-Mg合金残余应力和微屈服强度的影响。与未经扩散处理的合金相比，扩散处理后合金的微屈服强度提高了9.5%，相应的残余应力降低了-gt； 70%。这可以归因于扩散层厚度的增加和弹性能的释放。
Due to the low density and high fatigue strength, Al-Cu-Mg alloy has become an attractive material for aerospace and navigation applications. However, the relatively high residual stress and low micro-yield strength after the fabrication process restrict its further application in the field of inertial instruments. The objective of this work is to investigate the effect of Ni plating on the residual stress and micro-yield strength in an Al-Cu-Mg alloy under different diffusion treatments. Compared with properties of the alloy without diffusion treatment, the micro-yield strength of the alloy after diffusion treatment increases 9.5%, and the corresponding residual stress decreases > 70%. This can be attributed to the increase of diffusion layer thickness and release of elastic energy.