Modeling of cylindrical pin-fin heat sinks for electronic packaging
Modeling of cylindrical pin-fin heat sinks for electronic packaging
复制标题
用于电子封装的圆柱形针翅式散热器的建模
DOI：
10.1109/stherm.2005.1412168
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
M. Yovanovich
中科院分区：
文献类型：
--
作者：
W. Khan;J. Culham;M. Yovanovich
分析模型提出了确定热传递从在线和交错引脚鳍散热器用于电子封装应用。散热器的传热系数和散热器内流体的平均温度由控制体积上的能量平衡获得。此外，根据已发表的数据，建立了两种布置的摩擦系数模型。研究了导热系数对热工性能的影响。所有模型都可以应用于广泛的散热器参数范围，并适用于设计鳍式散热器。所提出的模型与现有的实验/数值数据符合得很好。
Analytical models are presented for determining heat transfer from in-line and staggered pin-fin heat sinks used in electronic packaging applications. The heat transfer coefficient for the heat sink and the average temperature for the fluid inside the heat sink are obtained from an energy balance over a control volume. In addition, friction coefficient models for both arrangements are developed from published data. The effects of thermal conductivity on the thermal performance are also examined. All models can be applied over a wide range of heat sink parameters and are suitable for use in the design of pin-fin heat sinks. The presented models are in good agreement with existing experimental/numerical data.