The edge cracking and decohesion of thin films
The edge cracking and decohesion of thin films
复制标题
DOI：
10.1016/0020-7683(94)90094-9
复制
发表时间：
1994-12
影响因子：
3.6
通讯作者：
A. Akisanya;N. Fleck
中科院分区：
文献类型：
--
作者：
A. Akisanya;N. Fleck
研究了基底上残余应力薄膜的开裂和脱粘过程。注意力集中在界面边缘裂纹，加载的线性变化的残余应力跨膜的厚度。用有限元法计算了界面应力强度因子和界面裂纹尖端的非奇异T应力，讨论了T应力和界面相位角对裂纹路径选择的影响。结果被用来预测的残余应力的分布，其中扭折开关从基板到薄膜。
The cracking and decohesion processes that may accompany a residually stressed thin film on a substrate have been investigated. Attention is focused on an interfacial edge crack, loaded by a linear variation of residual stress across the thickness of the film. The interfacial stress intensity factor and the non-singularT-stresses at the interfacial crack tip are evaluated using the finite element method, and the role of theT-stresses and the interfacial phase angle in influencing the selection of crack path is discussed. The results are used to predict the distributions of residual stress for which kinking switches from the substrate to the film.