Study on Al/Mg compound materials by solid–liquid bonding method
Study on Al/Mg compound materials by solid–liquid bonding method
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固液键合Al/Mg复合材料的研究
DOI：
10.1179/1433075x11y.0000000012
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发表时间：
2012
影响因子：
--
通讯作者：
T. Li
中科院分区：
文献类型：
--
作者：
X. Song;J. B. Sun;D. Zhong;Y. Yu;T. Wang;Z. Cao;T. Li
摘要采用固-液连接法制备了Al/Mg复合材料。可以获得具有过渡层的结合良好的界面。铸锭中存在两种界面结构。研究了Al/Mg界面的显微组织和连接性能。结果表明，铸锭顶部的脆性界面层主要由金属间化合物Al 12 Mg 17和Al 3 Mg 2组成，底部的脆性界面层主要由Al 3 Mg 2组成。解释了两种界面结构存在的原因。
Abstract Al/Mg compound materials were fabricated by a solid–liquid bonding method. The well bonded interface with a transition layer can be obtained. There were two kinds of interface structures in the ingot. The microstructures and bonding properties of Al/Mg interface were studied. The results showed that the brittle interface layer was composed mainly of intermetallic compound Al12Mg17 and Al3Mg2 at the top part and Al3Mg2 at the bottom part of ingot respectively. The reason why two kinds of interface structures existed was explained.