Automated Heatsink Optimization for Air-Cooled Power Semiconductor Modules
Automated Heatsink Optimization for Air-Cooled Power Semiconductor Modules
复制标题
风冷功率半导体模块的自动散热器优化
DOI：
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复制
发表时间：
2019
影响因子：
6.7
通讯作者：
S. Campbell
中科院分区：
文献类型：
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作者：
Tong Wu;Zhiqiang Wang;B. Ozpineci;M. Chinthavali;S. Campbell
热沉设计是提高功率半导体模块功率密度和可靠性的关键。本文提出了一种基于遗传算法和有限元分析的风冷散热器的自动化设计和优化方法。当遗传算法在每次迭代中生成具有复杂的横截面几何形状的候选者群体时，有限元分析被用于评估个体横截面的适应度函数，即，半导体器件的结温。与“适者生存”的规则，所提出的方法最终收敛到一个最佳的NMOS设计与最低的器件结温。通过三维打印技术制造优化的散热器，用于热性能评估。仿真和实验评估已经进行了50千瓦的三相风冷逆变器与制造的散热器的基础上。比较评估结果表明，优化的MOSFET是优于上级比定制的解决方案，减少27%的尺寸和6%的结温降低。
Heatsink design is critical for power density and reliability enhancement of power semiconductor modules. In this letter, an automated design and optimization methodology for air-cooled heatsinks are proposed based on genetic algorithm and finite element analysis. While the genetic algorithm generates a population of candidates with complex heatsink cross-section geometry in each iteration, finite element analysis is used to evaluate the fitness function of individual heatsink, i.e., junction temperature of semiconductor devices. With the rule of “survival of the fittest,” the proposed methodology eventually converges to an optimum heatsink design with the lowest device junction temperature. The optimized heatsink is fabricated through three-dimensional printing technology for thermal performance evaluation. Simulation and experimental evaluations have been conducted based on a 50-kW three-phase air-cooled inverter with the fabricated heatsinks. The comparative evaluation results show that the optimized heatsink is superior over a customized solution by 27% less in size and 6% lower in junction temperature.