Fabrication method of micromachined quartz glass resonator using sacrificial supporting structures
Fabrication method of micromachined quartz glass resonator using sacrificial supporting structures
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DOI：
10.1016/j.sna.2020.111922
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发表时间：
2020-04-15
影响因子：
4.6
通讯作者：
Tanaka, Shuji
中科院分区：
文献类型：
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作者：
Khan, Muhammad Jehanzeb;Tsukamoto, Takashiro;Tanaka, Shuji
在本研究中，提出了一种新的石英玻璃谐振器的制作方法。谐振器由Au柱机械支撑，Au柱也用作石英玻璃器件层和基板之间的粘合材料。机械支撑结构由锚固结构和牺牲支撑结构组成。在操作过程中，锚固结构保持以支撑所制造的谐振器，而在谐振器的释放过程中，牺牲支撑结构被移除。在整个制造过程中，采用牺牲支撑结构对易碎的谐振器结构进行机械支撑。支撑结构还起到了分散等离子体过程中产生的热量和保持器件层温度较低的作用。利用该方法，在石英玻璃衬底上成功地制作了微机械谐振器。该方法的最高工艺温度低于400℃，因此该方法在包括互补金属氧化物半导体(CMOS)衬底在内的各种衬底上制备石英玻璃微结构具有很大的潜力。(C)2020爱思唯尔B.V.保留所有权利。
In this study, a novel fabrication method of quartz glass resonators is proposed. The resonators are mechanically supported by Au posts, which are also used as bonding material between the quartz glass device layer and the substrate. The mechanical supporting structures consist of anchor structures and sacrificial supporting structures. The anchor structures remain to support the fabricated resonators during operation while the sacrificial supporting structures are removed during the release process of the resonator. The sacrificial supporting structures were employed to mechanically support the fragile resonator structure during the whole fabrication process. The supporting structures also played a role to dissipate the generated heat during the plasma process and keep the device layer temperature low. Using the proposed method, micromachined resonators were successfully fabricated on a quartz glass substrate. The maximum process temperature was less than 400 degrees C, thus the method has a large potential as a mean to fabricate quartz glass microstructures on various kind of substrates including the complimentary metal-oxide semiconductor (CMOS) substrates. (C) 2020 Elsevier B.V. All rights reserved.