Cooling rate and microstructure of rapidly solidified Al-20wt.% Si alloy
Cooling rate and microstructure of rapidly solidified Al-20wt.% Si alloy
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DOI：
10.1016/j.msea.2005.10.040
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发表时间：
2006-02
期刊：
影响因子：
6.4
通讯作者：
Chengyi Xu;H. Y. Wang;F. Qiu;Y. F. Yang;Q. Jiang
中科院分区：
文献类型：
--
作者：
Chengyi Xu;H. Y. Wang;F. Qiu;Y. F. Yang;Q. Jiang
采用单辊熔纺技术制备了40μm厚的熔纺带材，并获得了熔纺带材的温度分布。熔纺带材的凝固时间和冷却速率估计分别为6.59×10−5s和1.11×106℃/s。熔纺薄带中初生硅的形貌发生了巨大的变化，变成了细小的块状（初生硅的最大尺寸为5μm，初生硅的最小尺寸为0.5μm，平均尺寸为2μm），并且由于快速凝固可以获得更小的共晶硅。
A 40μm thick melt-spun ribbon was manufactured by using a single roller melt-spinning technique, and the temperature distribution of the melt-spun ribbon was obtained. The solidification time and the cooling rate of the melt-spun ribbon were estimated to be 6.59×10−5s and 1.11×106°C/s, respectively. The morphologies of primary silicon in the melt-spun ribbon were drastically changed to fine block-shape (maximum size of primary silicon is 5μm, minimum size of primary silicon is 0.5μm and average size of primary silicon is 2μm), and the smaller eutectic silicon can be obtained due to the rapid solidification.