Tolerance against conducting filament formation in nanosheet-derived titania thin films

Tolerance against conducting filament formation in nanosheet-derived titania thin films
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DOI:
10.1088/2632-959x/ab9024
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发表时间:
2020-05
期刊:
影响因子:
3
通讯作者:
Masaya Sato;M. Hara;Asami Funatsu;R. Nouchi
Masaya Sato;M. Hara;Asami Funatsu;R. Nouchi
中科院分区:
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文献类型:
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作者:
Masaya Sato;M. Hara;Asami Funatsu;R. Nouchi

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Herein, titania thin films are fabricated by a facile liquid-phase method based on vacuum filtration of a colloidal suspension of titania nanosheets, which is followed by thermal annealing to transform the nanosheet film into anatase TiO2. Nanosheet-derived titania thin films exhibit poor resistive switching with an interface-type mechanism. This behaviour is distinct from the filamentary switching that has been observed with titania thin films fabricated by other conventional techniques. This tolerance against conducting-filament formation may be ascribed to a low concentration of oxygen vacancies in nanosheet-derived films, which is expected because of the O/Ti ratio of titania (Ti0.87O2) nanosheets being larger than that of TiO2. Besides, the dielectric breakdown strength of nanosheet-derived films is found to be comparable to or higher than that of titania thin films fabricated by other techniques. These findings clearly indicate the usefulness of nanosheet-derived titania thin films for dielectric applications.