Thick-film acoustic emission sensors for use in structurally integrated condition-monitoring applications.
Thick-film acoustic emission sensors for use in structurally integrated condition-monitoring applications.
复制标题
用于结构集成状态监测应用的厚膜声发射传感器。
DOI:
10.1109/tuffc.2011.2043
复制
发表时间:
2011
期刊:
影响因子:
--
通讯作者:
Pickwell AJ
中科院分区:
文献类型:
--
作者:
Pickwell AJ
Monitoring the condition of complex engineering structures is an important aspect of modern engineering, eliminating unnecessary work and enabling planned maintenance, preventing failure. Acoustic emissions (AE) testing is one method of implementing continuous nondestructive structural health monitoring. A novel thick-film (17.6 μm) AE sensor is presented. Lead zirconate titanate thick films were fabricated using a powder/sol composite ink deposition technique and mechanically patterned to form a discrete thick-film piezoelectric AE sensor. The thick-film sensor was benchmarked against a commercial AE device and was found to exhibit comparable responses to simulated acoustic emissions.