Electroless deposition of Ni–B, Co–B and Ni–Co–B alloys using dimethylamineborane as a reducing agent
Electroless deposition of Ni–B, Co–B and Ni–Co–B alloys using dimethylamineborane as a reducing agent
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DOI：
10.1023/a:1003233715362
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发表时间：
1998-05
影响因子：
2.9
通讯作者：
T. Saito;E. Sato;M. Matsuoka;C. Iwakura
中科院分区：
文献类型：
--
作者：
T. Saito;E. Sato;M. Matsuoka;C. Iwakura
系统地研究了化学镀Ni-B、Co-B和Ni-Co-B合金的基本问题。合金的组成，晶体结构和沉积速率被确定为还原剂（二甲胺硼烷）和络合剂（酒石酸盐，柠檬酸盐，丙二酸盐和琥珀酸）的浓度，浴pH值和Ni 2 +/Co 2+比的函数。根据电化学极化数据和镍、钴硼化物的生成焓，讨论了由电镀参数的变化引起的合金的沉积速率和冶金特征的变化。
Fundamental aspects of electroless Ni–B, Co–B and Ni–Co–B alloys have been systematically examined. The composition, crystal structure and deposition rate of the alloys were determined as a function of the concentration of reducing agent (dimethylamineborane) and complexing agents (tartrate, citrate, malonate and succinic acid), bath pH and Ni2+/Co2+ ratio. Changes in the deposition rate and metallurgical features of the alloys induced by the change in plating parameters are discussed, based on electrochemical polarization data and the formation enthalpy of the nickel and cobalt borides.