Interface Of Aluminum/Ceramic Power Substrates Manufactured By Casting-Bonding Process

Interface Of Aluminum/Ceramic Power Substrates Manufactured By Casting-Bonding Process
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采用铸焊工艺制造的铝/陶瓷功率基板的界面

DOI：
10.1557/proc-445-101
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发表时间：
1996
期刊：
MRS Proceedings
影响因子：
--
通讯作者：
K. Suganuma
K. Suganuma
中科院分区：
--
文献类型：
--
作者：
X. Ning;Y. Ogawa;K. Suganuma

文献摘要

被引文献

相似文献

用于制造铝/陶瓷功率基板的新工艺已经开发出来。这些工艺采用铸造粘合方法将铝板粘合到陶瓷板的两侧。然后使用传统技术将在基板上形成的铝板化学蚀刻成所需的形状，然后在其上镀镍。该工艺制造的功率基板既具有完美的界面，又具有优异的热应力耐受性。因此，这些工艺特别适合组装高可靠性功率器件，例如IGBT功率模块。
New processes for manufacturing Al/ceramic power substrates have been developed. These processes use a casting-bonding method to bond Al plates to the both sides of ceramic plates. The Al plates formed on the substrates are then chemically etched to be a desired shape using the conventional technology, followed by plating nickel on them. The power substrates manufactured by the process have both a perfect interface and an excellent thermal stress tolerance. Hence, these processes are especially suitable for assembling high reliability power devices such as IGBT power modules.