Planarized Fabrication Process With Two Layers of SIS Josephson Junctions and Integration of SIS and SFS π-Junctions

Planarized Fabrication Process With Two Layers of SIS Josephson Junctions and Integration of SIS and SFS π-Junctions
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具有两层 SIS 约瑟夫森结的平面化制造工艺以及 SIS 和 SFS π 结的集成

DOI:
10.1109/tasc.2019.2901709
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发表时间:
2019
影响因子:
1.8
通讯作者:
L. Johnson
L. Johnson
中科院分区:
物理与天体物理3区
文献类型:
--
作者:
S. K. Tolpygo;V. Bolkhovsky;R. Rastogi;S. Zarr;A. Day;E. Golden;T. Weir;A. Wynn;L. Johnson

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我们提出了我们的新的超导电子制造工艺,集成了两层约瑟夫森结(JJ)在一个完全平面化的多层工艺200毫米晶圆。两个结层可以是,例如,具有相同或不同约瑟夫森临界电流密度的常规超导体-绝缘体-超导体(SIS)Nb/Al/<sub>AlOx</sub>/Nb结,<italic>J</italic><sub>c</sub>。该工艺还允许第一结层上的高<sub>Jc</sub>超导体-铁磁体-超导体(SFS)或SFS的JJ与第二JJ层上的Nb/Al/<sub>AlOx</sub><italic></italic>在本节点中,SFS三层,Nb/Ni/Nb被放置在标准SIS三层之下,并由一个铌布线层隔开。集成SFS和SIS结层的主要目的是在超导数字电路和随机存取存储器的逻辑单元中提供紧凑的π移相器,从而增加超导电子学的集成规模和功能密度。两结层工艺的当前节点具有六个平坦化的铌层、两个电阻层和350 nm的最小特征尺寸。SIS JJ的目标临界电流密度为100<italic>μ</italic> A/<italic>μ</italic><sup>m2</sup>和200<italic>μ</italic> A/<italic>μ</italic><sup>m2</sup>。我们提出了新工艺的显着特点,制造细节,并在两层集成到一个过程中的JJ的表征结果,无论是传统的和π结。
We present our new fabrication process for superconductor electronics that integrates two layers of Josephson junctions (JJs) in a fully planarized multilayer process on 200-mm wafers. The two junction layers can be, e.g., conventional superconductor-insulator-superconductor (SIS) Nb/Al/AlO<sub>x</sub>/Nb junctions with the same or different Josephson critical current densities, <italic>J</italic><sub>c</sub>. The process also allows integration of high-<italic>J</italic><sub>c</sub> superconductor–ferromagnet–superconductor (SFS) or SFS'S JJs on the first junction layer with Nb/Al/AlO<sub>x</sub>/Nb trilayer junctions on the second JJ layer, or vice versa. In the present node, the SFS trilayer, Nb/Ni/Nb is placed below the standard SIS trilayer and separated by one niobium wiring layer. The main purpose of integrating the SFS and SIS junction layers is to provide compact π-phase shifters in logic cells of superconductor digital circuits and random access memories, and thereby increase the integration scale and functional density of superconductor electronics. The current node of the two-junction-layer process has six planarized niobium layers, two layers of resistors, and 350-nm minimum feature size. The target critical current densities for the SIS JJs are 100 <italic>μ</italic>A/<italic>μ</italic>m<sup>2</sup> and 200 <italic>μ</italic>A/<italic>μ</italic>m<sup>2</sup>. We present the salient features of the new process, fabrication details, and characterization results on two layers of JJs integrated into one process, both for the conventional and π-junctions.
具有铁磁 π 结的相移通量量子位
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