Loop heat pipe technology for cooling computer servers
Loop heat pipe technology for cooling computer servers
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DOI：
10.1109/itherm.2008.4544248
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发表时间：
2008-05
期刊：
影响因子：
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通讯作者：
W. Zimbeck;Greg Slavik;James Yun
中科院分区：
文献类型：
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作者：
W. Zimbeck;Greg Slavik;James Yun
研制了一种用于双CPU 1U服务器冷却的风冷环路热管（LHP）系统。LHP采用新开发的平板蒸发器和风冷冷凝器，具有毫米级冷凝通道和平面平行翅片。台架试验使用20 x 20 mm均匀热源，耗散100瓦，并进行空气预热，模拟1U服务器机箱内的风冷操作。当空气温度从25℃升高到50℃时，热阻降低。在50℃的空气温度下，LHP蒸发器表面温度达到65℃，蒸发器表面对空气的有效热阻为0.15℃/W。在一台1U商用服务器上安装了两个100w的Intel至强处理器，用来比较LHP冷却系统和标准处理器风扇散热器的效率。使用多个CPU Burn实例来锻炼CPU的最大功耗。在类似的测试条件下，室温在26-30℃范围内，处理器的界面温度稳定在~75℃，风扇散热器稳定在~55℃，LHP冷却系统稳定在~55℃。
An air cooled loop heat pipe (LHP) system was developed for cooling a dual CPU 1U server. The LHP uses newly developed flat plate evaporators and air cooled condensers with millimeter scale condensation channels and plain parallel fins. Bench tests were conducted using 20 x 20 mm uniform heat sources dissipating 100 watts and air preheating to simulate air-cooled operation within a 1U server chassis. Thermal resistance was decreased as the air temperature increased from 25degC to 50degC. At 50degC air temperature, the LHP evaporator surface temperature reached 65degC showing an effective evaporator surface to air thermal resistance of 0.15degC/W. A commercial 1U server with dual 100 W rated Intel Xeon processors was used to compare the effectiveness of the LHP cooling system to the standard processor fan heat sinks. Multiple instances of CPU Burn were used to exercise the CPU's for maximum power dissipation. Under similar test conditions with room air temperature in the range 26-30degC, the interface temperature at the processors stabilized at ~75degC with the fan heat sinks and ~55degC with the LHP cooling system.