SuperSpec: design concept and circuit simulations

SuperSpec: design concept and circuit simulations
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DOI:
10.1117/12.927160
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发表时间:
2012-09
期刊:
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影响因子:
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通讯作者:
A. Kov'acs;P. Barry;C. Bradford;G. Chattopadhyay;P. Day;S. Doyle;S. Hailey-Dunsheath;M. Hollister;C. Mckenney;H. Leduc;N. Llombart;D. Marrone;P. Mauskopf;R. O’Brient;S. Padin;L. Swenson;J. Zmuidzinas
A. Kov'acs;P. Barry;C. Bradford;G. Chattopadhyay;P. Day;S. Doyle;S. Hailey-Dunsheath;M. Hollister;C. Mckenney;H. Leduc;N. Llombart;D. Marrone;P. Mauskopf;R. O’Brient;S. Padin;L. Swenson;J. Zmuidzinas
中科院分区:
其他
文献类型:
--
作者:
A. Kov'acs;P. Barry;C. Bradford;G. Chattopadhyay;P. Day;S. Doyle;S. Hailey-Dunsheath;M. Hollister;C. Mckenney;H. Leduc;N. Llombart;D. Marrone;P. Mauskopf;R. O’Brient;S. Padin;L. Swenson;J. Zmuidzinas

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SuperSpec 是未来光刻光谱仪相机的探路者,它有望在(亚)毫米波长下激发银河外天体物理学:在倍频程带宽上为望远镜视场中的每个像素提供 200–500 kms-1 光谱速度分辨率。我们提出的电路仿真证明了这一概念,该概念可以在仅几平方毫米的占地面积内实现完整的毫米波段光谱仪设备。我们评估单级和两级通道化滤波器设计,这些设计将通道分成一系列宽带检测器,例如测辐射热计或动感电感检测器 (KID) 设备。我们讨论损耗(通过辐射或电介质吸收)和制造公差在多大程度上影响此类设备的分辨率或性能,以及我们可以采取哪些措施来减轻退化。此类设计研究帮助我们制定对材料和制造工艺的关键要求,并帮助了解这些设备当前或未来几年所能提供的功能目前存在哪些实际限制。
SuperSpec is a pathfinder for future lithographic spectrometer cameras, which promise to energize extra-galactic astrophysics at (sub)millimeter wavelengths: delivering 200–500 kms-1 spectral velocity resolution over an octave bandwidth for every pixel in a telescope’s field of view. We present circuit simulations that prove the concept, which enables complete millimeter-band spectrometer devices in just a few square-millimeter footprint. We evaluate both single-stage and two-stage channelizing filter designs, which separate channels into an array of broad-band detectors, such as bolometers or kinetic inductance detector (KID) devices. We discuss to what degree losses (by radiation or by absorption in the dielectric) and fabrication tolerances affect the resolution or performance of such devices, and what steps we can take to mitigate the degradation. Such design studies help us formulate critical requirements on the materials and fabrication process, and help understand what practical limits currently exist to the capabilities these devices can deliver today or over the next few years.