Quantitative correlation between fracture toughness K1C and the short-term strength σb, σ0·2 of tungsten
Quantitative correlation between fracture toughness K1C and the short-term strength σb, σ0·2 of tungsten
复制标题
DOI:
10.1007/bf00805552
复制
发表时间:
1983-11
期刊:
影响因子:
--
通讯作者:
A. Babak
中科院分区:
文献类型:
--
作者:
A. Babak
Commercially pure tungsten, particularly alloy V-MP produced by a powder metallurgical method, is currently widely used as a structural material for components of moden technology. A distinguishing feature of this material is that it contains cracklike defects at grain boundaries [i]. Defects can occur in the material during fabrication of tungsten by high-temperature casting [i], or are concentrated around impurities in the material [2]. Some works are based on the possibility of microcrack occurrence at grain boundaries due to internal stresses ocurring during thermomechanical action [3-5]. The data of reference [6] indicate that crack development in a V-MP alloy at intermediate and high temperatures occurs predominantly along grain boundaries. A characteristic of the alloy under study is its tendency for hightemperature embrittlement, leading to a weakening of grain-boundary bonding [3, 7].Components in modern technology operate under conditions of verycomplex temperature--force effects. Consequently, during use of tungsten pieces, conditions occur favorable for the development of defects in an external stress field. The serviceability of a piece is determined by its resistance to the development of cracks, ie, to its fracture toughness. In other words, considering the structural changes in tungsten during thermomechanical action and the character of its damage, it can be supposed that the strength of tungsten is ultimately determined by its fracture toughness. In this case, there should be a quantitative relationship between the parameters characterizing the fracture toughness and those characterizing the short-term strength of the material.