Direct patterning of copper on polyimide using ion exchangeable surface templates generated by site-selective surface modification.
Direct patterning of copper on polyimide using ion exchangeable surface templates generated by site-selective surface modification.
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DOI：
10.1021/ja047700e
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发表时间：
2004-08
影响因子：
15
通讯作者：
K. Akamatsu;S. Ikeda;H. Nawafune;H. Yanagimoto
中科院分区：
文献类型：
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作者：
K. Akamatsu;S. Ikeda;H. Nawafune;H. Yanagimoto
我们通过将氢氧化钾溶液分配到聚酰亚胺上，展示了位点选择性化学表面改性，这限制了源金属离子，这些离子随后可用于无电阻和无掩膜的铜电路图案制造。金属化可以通过湿化学方法实现，提供对金属/聚合物界面结构的控制。由于该方法与其他现有的印刷技术兼容，并且比传统的基于光刻的方法简单得多，因此我们提出，目前的表面模板方法可能在金属化聚合物的制造以及具有各种电子电路元件的集成电路的开发中得到普遍应用。
We demonstrate site-selective chemical surface modification by dispensing potassium hydroxide solution onto polyimide, which confines source metallic ions that can subsequently be used in resist- and mask-free fabrication of copper circuit patterns. Metallization can be achieved by a wet chemical method, providing control over metal/polymer interfacial structures. Because the approach is compatible with other existing printing technologies and much simpler than conventional lithography-based methods, we propose that the present surface template method may be of general application in fabrication of metallized polymers as well as in development of integrated circuits with a variety of electronic circuit elements.