Ultrafast-laser inscription of a three dimensional fan-out device for multicore fiber coupling applications
Ultrafast-laser inscription of a three dimensional fan-out device for multicore fiber coupling applications
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DOI：
10.1364/oe.15.011691
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发表时间：
2007-09-03
期刊：
影响因子：
3.8
通讯作者：
Kar, A. K.
中科院分区：
文献类型：
--
作者：
Thomson, R. R.;Bookey, H. T.;Kar, A. K.
利用超快激光波导刻纹技术制作了一种扇出器件，该器件能使多芯光纤（MCF）的每个纤芯都能被光纤V形槽阵列（FVA）中的单模光纤寻址。通过利用这种技术的独特的三维制造能力，我们证明了由一维阵列的光纤组成的FVA和由二维阵列的核心组成的MCF之间的耦合。当耦合到所有核心的MCF同时，每个核心的平均插入损耗为5.0分贝，在1.55 μ m的频谱区域。此外，扇出表现出低串扰和低偏振相关损耗。(c)2007年，美国光学学会。
A fan-out device has been fabricated using ultrafast-laser waveguide-inscription that enables each core of a multicore optical fiber (MCF) to be addressed by a single mode fiber held in a fiber V-groove array (FVA). By utilizing the unique three-dimensional fabrication capability of this technique we demonstrate coupling between an FVA consisting of a one-dimensional array of fibers and an MCF consisting of a two-dimensional array of cores. When coupled to all cores of the MCF simultaneously, the average insertion loss per core was 5.0 dB in the 1.55 mu m spectral region. Furthermore, the fan-out exhibited low cross-talk and low polarization dependent loss. (c) 2007 Optical Society of America.