Evaluation of crack suppression effect of TiNiSMA foil embedded in CFRP cross-ply laminates with embedded small-diameter FBG sensor
Evaluation of crack suppression effect of TiNiSMA foil embedded in CFRP cross-ply laminates with embedded small-diameter FBG sensor
复制标题
DOI：
10.1299/jsmea.48.443
复制
发表时间：
2005-10-01
期刊：
影响因子：
--
通讯作者：
Takeda, N
中科院分区：
文献类型：
--
作者：
Amano, M;Okabe, Y;Takeda, N
将Ti-Ni形状记忆合金（SMA）箔和小直径光纤布拉格光栅（FBG）传感器同时埋入CFRP正交层板中。当试样被加热时，从嵌入的SMA箔产生恢复压缩力，其均匀化了由90度铺层中的裂纹引起的不均匀应变分布。于是，90度铺层中的拉伸应力被松弛，并且抑制了新的横向裂纹的出现。这种效果与嵌入式FBG传感器进行了评估。加热后，变形后的FBG反射光谱恢复到原来的形状，表明Ti-Ni SMA箔对抑制损伤是有效的。然而，90度铺层中的热残余拉伸应力的松弛也是有效的。三维有限元分析结果表明，热残余拉应力的松弛是抑制损伤发生和发展的主要原因。
A Ti-Ni shape memory alloy (SMA) foil and a small-diameter fiber Bragg grating (FBG) sensor were embedded simultaneously into a CFRP cross-ply laminate. When the specimen was heated, the recovery compressive force was generated from the embedded SMA foil, which homogenized the non-uniform strain distribution caused by cracks in the 90 degrees ply. Then, the tensile stress in the 90 degrees ply was relaxed and the occurrence of new transverse cracks was suppressed. This effect was evaluated with the embedded FBG sensor. When the specimen was heated, the deformed reflection spectrum of the FBG returned to its original shape, which suggested that Ti-Ni SMA foil was effective to suppress the damage. However, relaxation of thermal residual tensile stress in the 90 degrees ply was also effective. The result of the 3D FEA suggested that the suppression of damage occurrence and growth was mainly caused by the relaxation of thermal residual tensile stress.