Qiang Yu: "Reliability and Structural Optimization of BGA Packages" The PACIFIC RIM/ASME International,Intersociety Electronic & Photonic Packaging Conference & Exhibition. (in print). (1997)
Qiang Yu: "Reliability and Structural Optimization of BGA Packages" The PACIFIC RIM/ASME International,Intersociety Electronic & Photonic Packaging Conference & Exhibition. (in print). (1997)
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于强：“BGA封装的可靠性和结构优化” PACIFIC RIM/ASME International,Intersociety Electronic
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