Convex silica microlens arrays via femtosecond laser writing
Convex silica microlens arrays via femtosecond laser writing
复制标题
通过飞秒激光写入的凸二氧化硅微透镜阵列
DOI：
10.1364/ol.378606
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发表时间：
2020-02-01
期刊：
影响因子：
3.6
通讯作者：
Sun, Hong-Bo
中科院分区：
文献类型：
--
作者：
Hua, Jian-Guan;Ren, Hang;Sun, Hong-Bo
我们报道了用飞秒激光直接写入技术制造出形状、尺寸和曲率可控的硅凸微透镜阵列。利用染料溶液中的背面蚀刻技术进行激光加工，实现了材料去除的高保真控制和烧蚀碎屑表面的实时清理。采用热退火将表面粗糙度降低到3 nm （rms）。通过聚焦和成像测试，证实了该阵列具有良好的光学性能。占地面积100 × 100 μ m(2)的复杂3D微光学元件在1小时内被消融（实际应用所需）。材料去除速度为120 μ m(3)/s (6 × 10（5) nm(3)/脉冲），比采用掩模投影法的背面蚀刻提高了一个数量级以上。该方法适用于在透明硬材料上制作微光学元件。(C) 2020美国光学学会
We report fabrication of silica convex microlens arrays with controlled shape, size, and curvature by femtosecond laser direct writing. A backside etching in dye solution was utilized for laser machining high-fidelity control of material removal and real-time surface cleaning from ablation debris. Thermal annealing was applied to reduce surface roughness to 3 nm (rms). The good optical performance of the arrays was confirmed by focusing and imaging tests. Complex 3D micro-optical elements over a footprint of 100 x 100 mu m(2) were ablated within 1 h (required for practical applications). A material removal speed of 120 mu m(3)/s (6 x 10(5) nm(3)/pulse) was used, which is more than an order of magnitude higher compared to backside etching using a mask projection method. The method is applicable for fabrication of micro-optical components on transparent hard materials. (C) 2020 Optical Society of America