Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding
Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding
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超声波焊接粗铝线与铝合金焊盘之间的界面微观结构
DOI：
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发表时间：
2013
期刊：
影响因子：
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通讯作者：
Y. Takahashi
中科院分区：
文献类型：
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作者：
Masakatsu Maeda;S. Kitamori;Y. Takahashi
分析了粗铝丝与超声键合焊盘的界面微观结构，研究了键合阻碍相的行为。引线和衬底在键合区域的中心区域中形成直接键合界面，而在外围区域中的引线和衬底的表面由非晶Al 2 O 3键合防止层覆盖。通过施加超声波振动将无定形Al2O3层从表面上切掉，并形成介于线材和基材之间的许多球形颗粒。颗粒由非晶态Al_2O_3基体和Al层组成，颗粒通过非晶态Al_2O_3在接触的引线和衬底表面上的聚集，向键合区外移动而生长。结合区域扩展通过结合防止层已经被去除的区域。
Interfacial microstructures between thick Al wires and pads formed by ultrasonic bonding were analysed to investigate the behaviour of bond preventing phases. The wire and the substrate form direct bond interface in the central region of the bond area, whereas the surfaces of them in the peripheral region are covered by amorphous Al2O3 bond preventing layer. The amorphous Al2O3 layer is chipped off the surfaces by application of ultrasonic vibration and forms a number of spherical particles intervening between the wire and the substrate. The particles consist of amorphous Al2O3 matrix and lamellae of Al. The particles grow by accumulating the amorphous Al2O3 on the surfaces of the wire and the substrate in contact, moving outward the bond area. The bond area expands through the area where the bond preventing layer has been removed.