A survey of the thermal stability of an active heat sink
A survey of the thermal stability of an active heat sink
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DOI：
10.1109/itherm.1996.534585
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发表时间：
1996-05
期刊：
影响因子：
--
通讯作者：
E. De Baetselier;W. Goedertier;G. De Mey
中科院分区：
文献类型：
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作者：
E. De Baetselier;W. Goedertier;G. De Mey
在单独强制对流冷却不足的情况下，或者外壳的尺寸限制了散热器的尺寸，IC可以使用主动散热器进行冷却。与传统的翅片式散热器相比，它可以从大幅减小的尺寸或从IC到其周围环境的热量传输的重要增强中受益。主动散热器的功能是基于一个珀尔第效应冷却系统。主动式散热器控制IC对其周围环境的热阻。珀耳梯效应热泵是一个非线性系统。因此，对系统稳定性的调查远非显而易见。提出了珀尔梯效应热泵和NTCR（负温度系数电阻）温度传感器的热电模型。这些与IC封装和翅片散热器的热模型以及控制电路的电子模型有关。仿真结果表明，根据IC上的功率负载，电路的正向放大，以及环境温度的变化，系统的非线性热行为和不稳定性。后一种现象发生在集成电路所在的整个设备上电后。理论结果通过自制主动式散热器的红外热像测量得到了证实。
In cases where forced convective cooling alone is inadequate, or where the size of the housing limits the heat sink's dimensions, IC's can be cooled using an active heat sink. Compared to a classical finned heat sink, it can benefit from a substantial size reduction or from an important enhancement of the heat transport from the IC to its surroundings. The active heat sink's function is based upon a Peltier-effect cooling system. The active heat sink controls the IC's thermal resistance to its surroundings. The Peltier-effect heat pump is a non-linear system. Therefore, surveys of the system's stability are far from evident. Thermo-Electric models for both the Peltier-effect heat pump and a NTCR (Negative Temperature Coefficient Resistance) temperature sensor are presented. These are linked to thermal models for the IC packaging and a finned heat sink on one hand and to electronic models for the controlling circuit on the other hand. Simulations show non-linear thermal behaviour and system instabilities according to the power load on the IC, to the forward amplification of the circuit, but also to the ambient temperature change. The latter phenomenon occurs after power-on of the whole device of which the IC is a part. The theoretical results were confirmed by infrared thermographic measurements on a self constructed active heat sink.