A 3D printable diamond polymer composite: a novel material for fabrication of low cost thermally conducting devices
A 3D printable diamond polymer composite: a novel material for fabrication of low cost thermally conducting devices
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DOI：
10.1039/c6ra05261d
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发表时间：
2016-01-01
期刊：
影响因子：
3.9
通讯作者：
Paull, B.
中科院分区：
文献类型：
--
作者：
Kalsoom, U.;Peristyy, A.;Paull, B.
介绍了一种可快速3D打印成原型物体的导热复合材料的研制。在丙烯酸酯聚合物中加入10、20、25和30%(w/v)的2-4微米人造金刚石微粒，使用低成本立体平版3D打印机制备了复合结构。对所制备的材料进行了热传递速率、热膨胀系数和接触角的表征，并用高分辨电子显微镜、热重分析和热成像对其进行了分析。高分辨扫描电子显微镜证实，随着金刚石含量增加到25%(w/v)，复合材料的热传递速率略有提高，而基于相互连接的金刚石聚集体网络的30%(w/v)聚合物-金刚石复合材料的热传递速率显著提高。开发的材料被用于制造3D打印散热器和冷却线圈的原型，用于电子和流体设备的热管理应用。对3D打印对象进行的红外热成像验证了该复合材料与固有聚合物相比具有更好的性能。
The development of a thermally conducting composite material that can be rapidly 3D printed into prototype objects is presented. The composite structures containing 10, 20, 25 and 30% (w/v) of 2-4 micron sized synthetic diamond microparticles added to the acrylate polymer were produced using a low cost stereolithographic 3D printer. The prepared materials were characterised according to heat transfer rates, thermal expansion co-efficients and contact angles, and analysed using high resolution electron microscopy, thermogravimetric analysis and thermal imaging. The composites displayed minor enhancements in heat transfer rates with incrementing diamond content upto 25% (w/v), however a significant improvement was observed for the 30% (w/v) polymer-diamond composite, based on an interconnected diamond aggregate network, as confirmed by high resolution scanning electron microscopy. The developed material was used in the fabrication of prototype 3D printed heat sinks and cooling coils for thermal management applications in electronic and fluidic devices. Infrared thermal imaging performed on 3D printed objects verified the superior performance of the composite compared to the inherent polymer.