Rapid Silicon-to-Steel Bonding by Induction Heating for MEMS Strain Sensors
Rapid Silicon-to-Steel Bonding by Induction Heating for MEMS Strain Sensors
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DOI：
10.1109/jmems.2011.2179013
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发表时间：
2012-04-01
影响因子：
2.7
通讯作者：
Lin, Liwei
中科院分区：
文献类型：
--
作者：
Sosnowchik, Brian D.;Azevedo, Robert G.;Lin, Liwei
提出了一种用于微机电系统（MEMS）传感器应用的快速可制造的硅-钢键合技术。使用感应加热系统，该过程简单，清洁，廉价，快速，在3-5秒内发生键合。热产生被隔离在钢表面以下几微米内，允许可控的热预算，而不会损坏钢的表面处理。该工艺需要最少的表面处理，并且可以与各种不同的金属系统一起使用。用金、银和镍的粘合层形成的粘合剂显示出优异的机械特性，经受住超过+/-2000 μ m的表面应变。通过ANSYS模拟和实验测量不同厚度的硅衬底，100 μ m厚的基板表现出最大的应变灵敏度的转移应变进行了量化。一个双端音叉MEMS谐振应变传感器，结合到一个钢平行，表现出可重复的5.4倍的提高应变灵敏度相比，环氧树脂粘接。因此，这种坚固的键合工艺非常适合键合MEMS传感器，以监控汽车、制造业和其他恶劣环境行业中的组件。[2011-0214]
A rapid and manufacturable technique to bond silicon to steel for microelectromechanical system (MEMS) sensor applications is presented. Using an induction heating system, the process is simple, clean, inexpensive, and fast, with bonding occurring in 3-5 s. Heat generation is isolated to within several micrometers below the steel surface, allowing for a controllable thermal budget that does not damage the surface treatment of steel. The process requires minimal surface conditioning and may be used with a variety of different metal systems. Bonds formed with adhesion layers of gold, silver, and nickel showed excellent mechanical characteristics, surviving surface strains exceeding +/- 2000 mu epsilon. The transferred strain was quantified by ANSYS simulation and measured experimentally for silicon substrates of varying thicknesses, with the 100 mu m-thick substrates demonstrating the greatest strain sensitivity. A double-ended tuning fork MEMS resonant strain sensor, bonded to a steel parallel, demonstrated a repeatable 5.4-fold improvement in strain sensitivity compared to epoxy bonding. As such, this robust bonding process is well-suited for bonding MEMS sensors to monitor components in the automotive, manufacturing, and other harsh environment industries. [2011-0214]