Optical backplane for board-to-board interconnection based on a glass panel gradient-index multimode waveguide technology

Optical backplane for board-to-board interconnection based on a glass panel gradient-index multimode waveguide technology
复制标题

基于玻璃面板梯度折射率多模波导技术的板对板互连光背板

DOI:
10.1109/ectc.2013.6575581
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发表时间:
2013
期刊:
2013 IEEE 63rd Electronic Components and Technology Conference
影响因子:
--
通讯作者:
K. Lang
K. Lang
中科院分区:
--
文献类型:
--
作者:
L. Brusberg;H. Schroder;R. Pitwon;S. Whalley;C. Herbst;Allen M. Miller;M. Neitz;J. Roder;K. Lang

文献摘要

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未来的带宽需求迫使用于板级数据传输的光互连的发展。其目标是为数据中心和网络系统中的嵌入式光学架构开发技术解决方案,以显著降低功耗、提高能效、系统密度和带宽可扩展性,这在当今的铜驱动系统中是不可行的。提出了一种用于未来数据通信系统的无源光背板,该无源光背板包括具有集成光波导和到线路卡的标准化可插拔光耦合接口的印刷电路板(PCB)。我们的活动主要集中在采用集成梯度折射率多模波导的嵌入式玻璃基电光电路板(EOCB),这种电路板在关键的光通信波长上表现出非常低的传播损耗。采用经过验证的工业印刷电路板工艺,将带有平面集成光波导预处理的玻璃面板嵌入背板。设计了一种可插拔的光连接器和插座系统,用于连接线卡的光纤链路和背板的光波导电路。
Future bandwidth needs force the development of optical interconnects for data transmission at board level. The aim is to develop technology solutions for embedded optical architectures in data center and network systems to allow significant reduction in power consumption, increased energy efficiency, system density and bandwidth scalability, which is currently unfeasible in today's copper driven systems. A passive optical backplane comprising a printed circuit board (PCB) with integrated optical waveguides and standardized pluggable optical coupling interfaces to the line cards is proposed for future data communication systems. Our activities are focused on embedded glass-based electro-optical circuit boards (EOCB) with integrated gradient-index multimode waveguides, which exhibit very low propagation loss at key optical communication wavelengths. A pre-processed glass panel with planar integrated optical waveguides is embedded into a backplane by using proven industrial PCB processes. A pluggable optical connector and receptacle system is designed for connecting the optical fiber links of the line cards with the optical waveguide circuit of the backplane.