Optical backplane for board-to-board interconnection based on a glass panel gradient-index multimode waveguide technology
Optical backplane for board-to-board interconnection based on a glass panel gradient-index multimode waveguide technology
复制标题
基于玻璃面板梯度折射率多模波导技术的板对板互连光背板
DOI:
10.1109/ectc.2013.6575581
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发表时间:
2013
期刊:
影响因子:
--
通讯作者:
K. Lang
中科院分区:
文献类型:
--
作者:
L. Brusberg;H. Schroder;R. Pitwon;S. Whalley;C. Herbst;Allen M. Miller;M. Neitz;J. Roder;K. Lang
Future bandwidth needs force the development of optical interconnects for data transmission at board level. The aim is to develop technology solutions for embedded optical architectures in data center and network systems to allow significant reduction in power consumption, increased energy efficiency, system density and bandwidth scalability, which is currently unfeasible in today's copper driven systems. A passive optical backplane comprising a printed circuit board (PCB) with integrated optical waveguides and standardized pluggable optical coupling interfaces to the line cards is proposed for future data communication systems. Our activities are focused on embedded glass-based electro-optical circuit boards (EOCB) with integrated gradient-index multimode waveguides, which exhibit very low propagation loss at key optical communication wavelengths. A pre-processed glass panel with planar integrated optical waveguides is embedded into a backplane by using proven industrial PCB processes. A pluggable optical connector and receptacle system is designed for connecting the optical fiber links of the line cards with the optical waveguide circuit of the backplane.