Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns
Interconnect Fabrication by Electroless Plating on 3D-Printed Electroplated Patterns
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DOI：
10.1021/acsami.1c01890
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发表时间：
2021-04-15
影响因子：
9.5
通讯作者：
Minary-Jolandan, Majid
中科院分区：
文献类型：
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作者：
Bhuiyan, Md Emran Hossain;Moreno, Salvador;Minary-Jolandan, Majid
金属互连件是能源设备（例如燃料电池和电解电池、电池以及电子和光电设备）的基本部件。近年来，3D打印工艺为传统的基于光刻和真空的互连制造工艺提供了补充途径。在这些方法中，限制性电沉积（CED）过程使得能够很好地控制印刷金属的微观结构，直接印刷高导电性（接近体积值）的金属而无需烧结，印刷具有受控组成的合金，印刷用于各种应用（包括磁性应用）的功能金属，以及用于原位扫描电子显微镜（SEM）纳米机械实验。然而，由于该工艺的化学性质，该工艺的金属沉积速率（或整体印刷速度）相当慢。在这里，我们建议使用的CED过程中，打印一个单一的金属迹线层作为种子层，随后选定的区域化学镀。通过控制的活化位点，通过印刷的CED过程中，我们控制，在那里的金属生长的化学镀，并证明了复杂的薄膜图案的制造。我们的研究结果表明，这种组合的过程中提高了超过2个数量级的处理时间相比，逐层印刷过程的CED。此外，在不进行任何热退火的情况下，我们获得了电阻率分别低至体铜和镍的1.3倍和2倍的铜和镍薄膜。此外，我们的定量实验表明，所获得的薄膜表现出的机械性能接近块体金属具有优异的附着力的基板。我们展示了潜在的应用射频识别（RFID）标签，复杂的印刷电路板图案，和电阻传感器在培养皿中的潜在的生物应用。
The metallic interconnects are essential components of energy devices such as fuel cells and electrolysis cells, batteries, as well as electronics and optoelectronic devices. In recent years, 3D printing processes have offered complementary routes to the conventional photolithography- and vacuum-based processes for interconnect fabrication. Among these methods, the confined electrodeposition (CED) process has enabled a great control over the microstructure of the printed metal, direct printing of high electrical conductivity (close to the bulk values) metals on flexible substrates without a need to sintering, printing alloys with controlled composition, printing functional metals for various applications including magnetic applications, and for in situ scanning electron microscope (SEM) nanomechanical experiments. However, the metal deposition rate (or the overall printing speed) of this process is reasonably slow because of the chemical nature of the process. Here, we propose using the CED process to print a single layer of a metallic trace as the seed layer for the subsequent selected-area electroless plating. By controlling the activation sites through printing by the CED process, we control, where the metal grows by electroless plating, and demonstrate the fabrication of complex thin-film patterns. Our results show that this combined process improves the processing time by more than 2 orders of magnitude compared to the layer-by-layer printing process by CED. Additionally, we obtained Cu and Ni films with an electrical resistivity as low as similar to 1.3 and similar to 2 times of the bulk Cu and Ni, respectively, without any thermal annealing. Furthermore, our quantitative experiments show that the obtained films exhibit mechanical properties close to the bulk metals with an excellent adhesion to the substrate. We demonstrate potential applications for radio frequency identification (RFID) tags, for complex printed circuit board patterns, and resistive sensors in a Petri dish for potential biological applications.