Investigation of the factors responsible for burns during MRI
Investigation of the factors responsible for burns during MRI
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DOI：
10.1002/jmri.1088
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发表时间：
2001-04-01
影响因子：
4.4
通讯作者：
Hadley, DM
中科院分区：
文献类型：
--
作者：
Dempsey, MF;Condon, B;Hadley, DM
据报道，在临床增材制造手术期间发生了许多烧伤事故。本研究的目的是调查导致此类烧伤的可能因素。进行实验是为了研究在 AM 过程中引起铜线发热的三种可能机制：导电环中的直接电磁感应、谐振导电环中的感应以及与导线的电场谐振耦合（天线效应）。环路的最大记录温升为 0.6 摄氏度，谐振环路为 61.1 摄氏度，谐振天线为 63.5 摄氏度。这些实验结果表明，与普遍看法相反，导电回路中的直接感应不太可能导致热损伤。由于谐振导电环的形成以及形成谐振天线的延长线，更容易发生烧伤事故。制定安全指南时应考虑共振的特点。 (C) 2001 Wiley-Liss, Inc.
Numerous reported burn injuries have been sustained during clinical AM procedures. The aim of this study was to investigate the possible factors that may be responsible for such burns. Experiments were performed to investigate three possible mechanisms for causing heating in copper wire during AM: direct electromagnetic induction in a conductive loop, induction in a resonant conducting loop, and electric field resonant coupling with a wire (the antenna effect). Maximum recorded temperature rises were 0.6 degreesC for the loop, 61.1 degreesC for the resonant loop, and 63.5 degreesC for the resonant antenna. These experimental findings suggest that, contrary to common belief, it is unlikely that direct induction in a conductive loop will result in thermal injury. Burn incidents are more likely to occur due to the formation of resonant conducting loops and from extended wires forming resonant antenna. The characteristics of resonance should be considered when formulating safety guidelines. (C) 2001 Wiley-Liss, Inc.