A study of ceramic addition in end termination of multilayer ceramics capacitors with cofiring process
A study of ceramic addition in end termination of multilayer ceramics capacitors with cofiring process
复制标题
共烧多层陶瓷电容器端接陶瓷添加的研究
DOI：
10.1016/j.matchemphys.2006.01.020
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发表时间：
2006
影响因子：
4.6
通讯作者：
F. Shieu
中科院分区：
文献类型：
--
作者：
Ying;C. Lee;Stanley Wang;F. Shieu
采用添加陶瓷的银浆料作为终端材料，对Ag 95-Pd 05内电极ZnO-B2 O3 + Zn 0. 95 Mg 0. 05 TiO 3 + 0. 25 TiO 2陶瓷（ZnBO-ZMT′）多层陶瓷电容器（MLCC）进行了研究。采用流延法制备了ZnBO-ZMT′粉体的绿色片。将Ag 95-Pd 05附着在绿色片上作为内部电极。层压后，将绿色芯片在800°C下预烧结1小时，然后将样品浸入外部电极并在900°C下共烧2小时。由于没有额外的固化工艺，因此可以降低生产成本并且可以减少MLCC的热冲击。为了改善在烧结过程中端接和介电体之间的失配，使用具有不同量的陶瓷的银膏，例如，20、30和40重量%，添加到本研究中。随后研究了MLCC的机械和电学性能。结果表明，40wt%的封端效果最好添加20和30 wt.%的陶瓷对MLCC的机械性能有较好的改善，但等效串联电阻（ESR）略高于端接陶瓷添加剂
The silver paste with ceramics addition as end termination was performed on multilayer ceramic capacitors (MLCC) based on ZnO–B2O3+Zn0.95Mg0.05TiO3+0.25TiO2ceramic (ZnBO-ZMT′) with Ag95–Pd05 internal electrodes. A green sheet was prepared by tape casting using the ZnBO-ZMT′ powders. Ag95–Pd05 was attached on the green sheet as an internal electrode. After lamination, the green chips were pre-sintered at 800°C for 1h, then samples were dipped the external electrodes and were cofired together at 900°C for 2h. There is no extra curing process, so the production cost may be cut down and thermal shock of the MLCCs may be reduced. To improve the mismatch between end termination and dielectric body during sintering, the silver paste with different amounts of ceramics, e.g., 20, 30 and 40wt.%, was added in this study. The mechanical and electrical properties of the MLCCs were investigated subsequently. The results showed that end termination with 40wt.% ceramic addition has good performances on mechanical properties of MLCC, but equivalent series resistance (ESR) is a little bit higher compared to end termination with 20 and 30wt.% ceramic addition.