Analysis of temperature rapid rise phenomenon during damper-off cycle in side-by-side frost-free refrigerator
Analysis of temperature rapid rise phenomenon during damper-off cycle in side-by-side frost-free refrigerator
复制标题
对开门无霜冰箱关风门循环温度快速升高现象分析
DOI：
10.1016/j.ijrefrig.2021.10.014
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发表时间：
2021-10
影响因子：
3.9
通讯作者：
Wei Xinghua
中科院分区：
文献类型：
--
作者：
Yang Yikun;Huang Dong;Zhao Rijing;Guo Wenhua;Wei Xinghua
并列式无霜冰箱在关风循环中经常出现温度快速上升现象，导致关风持续时间缩短，能耗增加。建立了三维瞬态自然对流模型，并对关风循环过程中冷藏室温度快速上升现象进行了实验验证。结果表明，温度场的不均匀性会引起强烈的自然对流，从而导致钢筋混凝土温度场的显著变化。热空气从底部沿沿着三个通道上升到顶层，这三个通道包括搁板与门盒之间的前间隙（FG）、右侧壁与门盒之间的侧间隙（SG）以及搁板与后壁之间的后间隙（RG）。沿着FG进入第一层的空气焓是导致温度快速上升的主导因素，约占总来流空气焓的64.4%。在前15 s内，沿沿着FG的净空气焓流大于其它通道，随着温度分布的均匀化，净空气焓流迅速减小。
The temperature rapid rise phenomenon often happens in the side-by-side frost-free refrigerators during the damper-off cycle, which leads to a decrease in damper-off duration and an increase in energy consumption. A three-dimensional transient model of natural convection during the damper-off cycle is established and experimentally validated to analyze the refrigerating compartment (RC) temperature rapid rise phenomenon. The results show that the violent natural convection airflow driven by the non-uniform temperature distribution will lead to the significant variation of RC temperature. The hot air rises from bottom into top layer along the three passages, which include the front gap (FG) between shelves and door boxes, the side gap (SG) between the right-side wall and door boxes and the rear gap (RG) between shelves and the rear wall. The air enthalpy along FG into the first layer is the dominant factor of the temperature rapid rise, accounting for almost 64.4% of the total inflow air enthalpy. The net air enthalpy flow along FG is larger than other passages in the first 15 s and decreases rapidly as the temperature distribution becomes uniform.
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DOI：
10.1016/j.ijrefrig.2006.06.006
发表时间：
2007-03
期刊：
International Journal of Refrigeration-revue Internationale Du Froid
影响因子：
--
作者：
J. Gupta;M. Gopal;S. Chakraborty
通讯作者：
J. Gupta;M. Gopal;S. Chakraborty
影响因子：
6.4
作者：
Jae Hyuk Wie;H. Cho;Y. Park;Young Soo Kim;Y. M. Seo;M. Ha
通讯作者：
Jae Hyuk Wie;H. Cho;Y. Park;Young Soo Kim;Y. M. Seo;M. Ha
影响因子：
6.4
作者：
Zhiqiang Li;Xianshun Zeng;Dan Zhao;G. Ding
通讯作者：
Zhiqiang Li;Xianshun Zeng;Dan Zhao;G. Ding
影响因子：
6.4
作者：
J. M. Belman-Flores;A. Gallegos-Muñoz
通讯作者：
J. M. Belman-Flores;A. Gallegos-Muñoz
影响因子：
10.4
作者：
Kai-Shing Yang;W. R. Chang;I. Chen;Chi-Chuan Wang
通讯作者：
Kai-Shing Yang;W. R. Chang;I. Chen;Chi-Chuan Wang