Development of EDA Techniques for Power Module EMI Modeling and Layout Optimization
Development of EDA Techniques for Power Module EMI Modeling and Layout Optimization
复制标题
电源模块 EMI 建模和布局优化的 EDA 技术开发
DOI:
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发表时间:
2019
期刊:
影响因子:
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通讯作者:
H. Mantooth
中科院分区:
文献类型:
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作者:
Tristan M. Evans;Quang Le;B. Narayanasamy;Yarui Peng;F. Luo;H. Mantooth
The design of power electronics modules is undergoing renewed interest as new challenges and technologies emerge in the realm of wide bandgap (WBG) power device packaging. In order to meet the demands of these high-speed transistors, novel techniques are required to produce modules with reduced parasitics and noise generation without exceeding the operating temperature of the devices or their packaging materials. Traditionally, power module design has been a highly iterative process—repeatedly reworking and simulating designs using finite element analysis (FEA) tools that require considerable time in terms of both labor and computation. To overcome these issues, an electronic design automation tool (EDA) known as PowerSynth is ongoing in its development toward power module layout synthesis and optimization based on electrical and thermal criteria. In this paper, work to extend the capabilities of PowerSynth to optimize layouts with reduced electromagnetic interference (EMI) is presented. Optimization strategies based on the transfer functions of noise propagation paths are introduced and results showing layouts with reduced noise generation are compared with FEA simulations.