Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Electrodeposited Copper Foil
Cyclic Biaxial Stress Measurement Method Using the Grain Growth Direction in Electrodeposited Copper Foil
复制标题
利用电解铜箔晶粒生长方向的循环双轴应力测量方法
DOI：
10.1155/2010/928216
复制
发表时间：
2010
影响因子：
1.9
通讯作者：
D. Hino
中科院分区：
文献类型：
--
作者：
Y. Ono;Cheng Li;D. Hino
本文提出了一种利用电沉积铜箔中晶粒生长方向测量双轴循环应力的方法。在不同双轴应力比的循环加载试验后，通过图像处理软件测量晶粒生长方向。当双轴应力比为负时，由于晶粒沿两个方向生长，且生长方向与最大剪应力方向一致，因此可以用莫尔应力圆测量主应力。另一方面，当双轴应力比为正时，上述特征不发生。因此，可以基于晶粒生长密度来测量第一主应力。测量双轴应力所需的晶粒数由统计方法估计。
A method that uses grain growth direction in electrodeposited copper foil to measure cyclic biaxial stress is examined in this paper. The grain growth direction is measured by image processing software after a cyclic loading test for various biaxial stress ratios is carried out. Since the grain growth occurs in two directions and its directions correspond closely with the direction of maximum shearing stress when the biaxial stress ratio is negative, the principal stress can be measured using Mohr's stress circle. On the other hand, when the biaxial stress ratio is positive, above-mentioned feature does not occur. Therefore, the first principal stress can be measured based on the grain growth density. The number of grains necessary to measure the biaxial stress is estimated by a statistical approach.