State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography
State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography
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DOI：
10.1109/tpel.2013.2288334
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发表时间：
2014-09-01
影响因子：
6.7
通讯作者：
Crichton, Stuart
中科院分区：
文献类型：
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作者：
Li, Kongjing;Tian, Gui Yun;Crichton, Stuart
绝缘栅双极晶体管 (IGBT) 模块是电力系统中重要的安全关键组件。键合线剥离是由重复的功率/热循环引起的键合线和器件相邻层之间的塑性变形，是 IGBT 模块中最常见的故障机制。为了及早检测和表征此类故障，持续检测或监控 IGBT 模块的健康状态，尤其是键合线的状态非常重要。本文介绍了涡流脉冲热成像 (ECPT)，这是一种无损评估技术，用于 IGBT 模块中键合线剥离的状态检测和表征。介绍了实验ECPT系统后，介绍了数值模拟工作。所提出的模拟基于 3D 电磁热耦合有限元方法，并分析键合线内的瞬态温度分布。本文说明了在两种激励条件（非均匀和均匀磁场激励）下，使用不同焊线状态（剥离或良好键合）的感应加热键合线的热模式。实验结果表明，使用亥姆霍兹线圈均匀激励健康的键合线，可以在每条键合线上提供相同的涡流，而在有缺陷的线上可以看到不同的涡流。实验和数值结果均表明，ECPT 可通过分析焊线的瞬态加热模式来检测和表征功率半导体中的焊线。本文的主要影响在于，这是电磁感应热成像技术（即所谓的 ECPT）首次应用于电力/电子设备。由于其能够一次性对多条电线进行非接触式检查，因此它为电力/电子设备的故障检测、性能表征和健康状况监测开辟了广阔的研究领域。
Insulated gate bipolar transistor (IGBT) modules are important safety critical components in electrical power systems. Bond wire lift-off, a plastic deformation between wire bond and adjacent layers of a device caused by repeated power/thermal cycles, is the most common failure mechanism in IGBT modules. For the early detection and characterization of such failures, it is important to constantly detect or monitor the health state of IGBT modules, and the state of bond wires in particular. This paper introduces eddy current pulsed thermography (ECPT), a nondestructive evaluation technique, for the state detection and characterization of bond wire lift-off in IGBT modules. After the introduction of the experimental ECPT system, numerical simulation work is reported. The presented simulations are based on the 3-D electromagnetic-thermal coupling finite-element method and analyze transient temperature distribution within the bond wires. This paper illustrates the thermal patterns of bond wires using inductive heating with different wire statuses (lifted-off or well bonded) under two excitation conditions: nonuniform and uniform magnetic field excitations. Experimental results show that uniform excitation of healthy bonding wires, using a Helmholtz coil, provides the same eddy currents on each, while different eddy currents are seen on faulty wires. Both experimental and numerical results show that ECPT can be used for the detection and characterization of bond wires in power semiconductors through the analysis of the transient heating patterns of the wires. The main impact of this paper is that it is the first time electromagnetic induction thermography, so-called ECPT, has been employed on power/electronic devices. Because of its capability of contactless inspection of multiple wires in a single pass, and as such it opens a wide field of investigation in power/electronic devices for failure detection, performance characterization, and health monitoring.