Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves

Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves
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超声波作用下液态Sn与ZrO2陶瓷的界面反应行为及结合机理

DOI:
10.1016/j.ceramint.2017.03.042
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发表时间:
2017-07
影响因子:
5.2
通讯作者:
Li Mingyu
Li Mingyu
中科院分区:
材料科学1区
文献类型:
--
作者:
Luo Dan;Xiao Yong;Wang Ling;Liu Li;Zeng Xian;Li Mingyu

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本研究采用超声辅助浸渍技术,在熔融锡基焊料中浸渍氧化锆陶瓷,实现了氧化锆陶瓷的低温连接。采用扫描电子显微镜和能谱仪、X射线衍射仪和X射线光电子能谱研究了超声振动对锡/氧化锆界面组织结构的影响,探讨了锡涂层与氧化锆陶瓷的连接机理。结果表明,在S熔体中超声浸锡1200h后,在ZrO2表面形成了厚度约为8~9µm的纯锡焊料层。锡涂层与氧化锆陶瓷具有良好的冶金结合性能。在界面处形成了纳米级的ZrSnO4三元相,有利于晶格从锡焊料向氧化锆陶瓷的顺利过渡。由于声空化作用引起了锡、氧和氧化锆在熔融的锡/氧化锆陶瓷界面上的高温反应,从而形成了氧化锌中间层。试验结果表明,ZrO2/Sn2/ZrO2焊点的平均剪切强度约为32 Mpa,剪切破坏主要发生在焊料层内。
Ultrasound-assisted dipping of ZrO2ceramics into molten Sn solder was performed to realize the low-temperature joining of ZrO2ceramics in this study. Scanning electron microscopy with energy dispersive spectrometer, X-ray diffraction and X-ray photoelectron spectroscopy were employed to study the effects of ultrasonic vibration on the microstructure of Sn/ZrO2interface, and to elucidate the joining mechanism between Sn coating layer and ZrO2ceramic. Results showed that, after ultrasonically dipping in molten Sn for 1200 s, a pure Sn solder layer with a thickness of approximately 8–9 µm was coated on the ZrO2surface. The Sn coating layer exhibited excellent metallurgic bonding with ZrO2ceramic. A nano-sized ZrSnO4ternary phase, which was beneficial to the smooth transition of the lattice from Sn solder to ZrO2ceramic, was formed at the Sn/ZrO2interface. The formation of ZrSnO4interlayer was ascribed to the acoustic cavitation induced high-temperature reaction of Sn, O and ZrO2at the molten Sn/ZrO2ceramic interface. The tested average shear strength of ZrO2/Sn/ZrO2joints was approximately 32 MPa, and the shearing failure mainly took place within the Sn solder layer.
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