Electroless Ni–P coating preparation of conductive mica powder by a modified activation process
Electroless Ni–P coating preparation of conductive mica powder by a modified activation process
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DOI：
10.1016/j.apsusc.2006.05.010
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发表时间：
2006-12
影响因子：
6.7
通讯作者：
H. Dai;Hongxi Li;Fu-hui Wang
中科院分区：
文献类型：
--
作者：
H. Dai;Hongxi Li;Fu-hui Wang
研究了导电云母粉化学镀Ni-P镀层的活化工艺。采用Pd（II）-APTHS活化剂代替传统的敏化和活化步骤，改进了化学镀Ni-P工艺。采用XPS、SEM/EDX、TEM等手段对活化反应过程及Ni-P镀层进行了表征。通过该活化过程成功地引发了化学镀镍。该活化工艺简单，所得Ni-P镀层均匀、连续、致密。Ni-P涂覆的云母粉末的平均比电阻率为4.85×10 - 2Ωcm。
A modified activation process was developed for electroless Ni–P coating preparation of conductive mica powder. The electroless Ni–P coating process was modified by replacing the conventional sensitization and activation steps only using activation step with a Pd(II)–APTHS activator, which is a complex of Pd(II) ion with a derivate γ-aminopropyltrihydroxysilane (APTHS) from the hydrolysis of γ-aminopropyltriethoxysilane (APTES). The activated reaction progress and resulted Ni–P coating were characterized by XPS, SEM/EDX and TEM. Electroless nickel deposition was successfully initiated by this activation process. This activation process is very simple, and the obtained Ni–P deposits have the advantages of uniformity, continuity and densification. The average specific resistivity for the Ni–P coated mica powder was 4.85×10−2Ωcm.