Study of Bi(2223) tapes with low thermal conductivity
Study of Bi(2223) tapes with low thermal conductivity
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低导热率Bi(2223)带材的研究
DOI：
10.1109/77.919764
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发表时间：
2001
期刊：
影响因子：
--
通讯作者：
W. Goldacker
中科院分区：
文献类型：
--
作者：
M. Putti;M. R. Cimberle;C. Ferdeghini;G. Grasso;A. Manca;W. Goldacker
本文描述了一种在4 ~ 200 K温度范围内静态测量Bi(2223)/ ag包覆带导热系数的装置。标准的实验技术已经得到了改进，实现了原始样品的排列，最大限度地减少了辐射的热损失。我们对具有不同金属护套的Bi（2223）带进行了一组热导率测量。当护套由纯银转变为银合金时，热导率变化在4个数量级以内。从这些测量中提取了几种AgAu和AuMg合金的导热系数，并讨论了观察到的不可预测材料性能的来源和机制。
In this paper we describe an apparatus for static measurements of the thermal conductivity of Bi(2223)/Ag-sheathed tapes in a temperature range going from 4 K to 200 K. The standard experimental technique has been improved by the implementation of an original sample arrangement that minimizes the thermal losses by radiation. We have performed a set of measurements of thermal conductance on Bi(2223) tapes with different metallic sheaths. The thermal conductance varies within four order of magnitude when the sheath is changed from pure Ag to Ag alloys. The thermal conductivity of several AgAu and AuMg alloys has been extracted from these measurements, discussing then the origins and the mechanisms for the observed unpredicted material properties.