Use of the reverse pulse plating method to improve the properties of cobalt–molybdenum electrodeposits
Use of the reverse pulse plating method to improve the properties of cobalt–molybdenum electrodeposits
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DOI：
10.1016/j.surfcoat.2006.04.011
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发表时间：
2006-12
影响因子：
5.4
通讯作者：
E. Pellicer;E. Gómez;E. Vallés
中科院分区：
文献类型：
--
作者：
E. Pellicer;E. Gómez;E. Vallés
Conditions leading to cobalt–molybdenum (Co–Mo) electrodeposits with high Mo percentages were studied. Deposits prepared by means of direct current electroplating showed a large amount of cracks. Maximum amount of Mo in the films was attained by applying deposition potentials in the −1200mV to −1300mV range. Reverse pulse plating mode has been proved useful for obtaining nanocrystalline, low stressed Co–Mo deposits with similar Mo percentages as in direct current conditions (35–40wt.%). The coatings were exposed to a static microindentation test, which highlighted that the pulse plated samples were more compact and less fragile than the direct current plated ones.
