Wetting and brazing of YIG ceramics using Ag-CuO-TiO2 metal filler
Wetting and brazing of YIG ceramics using Ag-CuO-TiO2 metal filler
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Ag-CuO-TiO2 金属填料对 YIG 陶瓷的润湿和钎焊
DOI：
10.1016/j.jmrt.2020.12.080
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发表时间：
2021-01-07
影响因子：
6.4
通讯作者：
He, Peng
中科院分区：
文献类型：
--
作者：
Zhao, Wanqi;Zhang, Shuye;He, Peng
首次研究了 Y3Fe5O12 (YIG) 陶瓷与 Ag-8CuO-2TiO(2) 填料的润湿和钎焊。为了进行比较，类似地研究了 Ag-10CuO 填料在 YIG 陶瓷上的润湿性。 Ag-8CuO-2TiO(2)填料在1000℃下在YIG基底上的平衡接触角约为31℃；因此，其润湿性优异。而且其润湿性超过了Ag-10CuO。使用扫描电子显微镜、X射线衍射、EPMA和透射电子显微镜测定了填料和基材之间的微观结构和界面结构。液态Ag-8CuO-2TiO(2)填料可以与YIG基底反应，形成连续的Y2Ti2O7层和点状的CuFe2O4，促进润湿行为和结合性能。在 1000 摄氏度的钎焊温度下，接头的平均剪切强度可超过 30 MPa。由于破裂发生在陶瓷侧接缝附近，因此通过纳米压痕来表征界面的强度。掺杂TiO2的界面硬度超过Ag-10CuO，Y2Ti2O7中的点状CuFe2O4增强了界面的硬度。 (C) 2020 作者。由 Elsevier B.V. 出版
The wetting and brazing of Y3Fe5O12 (YIG) ceramics with a Ag-8CuO-2TiO(2) filler was investigated for the first time. For comparison, the wettability of a Ag-10CuO filler on YIG ceramics was similarly investigated. The Ag-8CuO-2TiO(2 )filler has an equilibrium contact angle of approximately 31 degrees C on the YIG substrate at 1000 degrees C; thus, its wettability is excellent. Moreover, its wettability exceeds that of Ag-10CuO. The microstructure and the interfacial structure between the filler and the substrate were determined using scanning electron microscopy, X-ray diffraction, EPMA and transmission electron microscopy. The liquid Ag-8CuO-2TiO(2) filler can react with the YIG substrate by forming continuous Y2Ti2O7 layers with dotted CuFe2O4 and promote the wetting behavior and bonding performance. The average shear strength could exceed 30 MPa for the joints at a brazing temperature of 1000 degrees C. As rupture occurred adjacent to the seam at the ceramic side, the strengths of the interfaces were characterized via nanoindentation. The hardness of the interface with doped TiO2 exceeds that of Ag-10CuO, which is strengthened by the dotted CuFe2O4 among Y2Ti2O7 . (C) 2020 The Author(s). Published by Elsevier B.V.