Real-Time Compact Thermal Models for Health Management of Power Electronics
Real-Time Compact Thermal Models for Health Management of Power Electronics
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DOI：
10.1109/tpel.2010.2040634
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发表时间：
2010-02
影响因子：
6.7
通讯作者：
M. Musallam;C. M. Johnson
中科院分区：
文献类型：
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作者：
M. Musallam;C. M. Johnson
电力电子器件的实时健康评估和热管理的实现需要实时的电热模型，这些模型可以用来预测设备结点、接口等的温度，而这些温度在运行过程中通常无法测量。本文提出了一种实时降阶紧凑型热模型，该模型包含在脉宽调制和电流控制的全桥中。通过实验获得了动态热行为的准确表示，并将其转换为简化的多指数形式，然后与提供基于相电流测量值的器件损耗估计的查找表相结合。对于远离表面的界面，如焊料层，使用经过验证的Flotherm模型来预测隐藏层的温度。实时温度估计值与高速红外相机的红外测量值的比较表明，降阶模型能够在一系列调制条件下估计模块的温度。该实时模型非常适合于连续监测电力电子模块内部电热效应的内部行为，因此可以作为预测工具的一部分，通过与电力电子健康管理的热机械磨损模型相结合，通过热循环提供知识。
Implementation of real-time health assessment and thermal management of power electronic devices require real-time electrothermal models that can be used to predict the temperatures of device junctions, interfaces, etc., which cannot ordinarily be measured during service. This paper presents a real-time reduced-order compact thermal model, which is incorporated in a pulsewidth modulation and current controlled full bridge. An accurate representation of the dynamic thermal behavior was obtained experimentally and converted into a simplified multiexponential form then combined with lookup tables that provide estimates of the device losses based on measured values of the phase current. For interfaces away from the surface, such as solder layers, a validated Flotherm model is used to predict the temperatures of the hidden layers. Comparison of the real-time temperature estimates with IR measured values obtained from a high-speed IR camera showed that the reduced-order model was capable in estimating the module's temperatures over a range of modulation conditions. This real-time model is well-suited to the continuous monitoring of the internal behavior of the electrothermal effects within power electronic modules and can thus be used as part of a prognostic tool to provide knowledge through thermal cycling by combining with thermomechanical wear out models for health management of power electronics.