Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
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DOI：
10.1115/1.4049292
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发表时间：
2021-06-01
影响因子：
1.6
通讯作者：
Ang, Simon
中科院分区：
文献类型：
--
作者：
Nasiri, Ardalan;Ang, Simon
研究了用于高温(300-500℃)电子封装的氧化铝基芯片贴合和封装。该氧化铝浆体材料以磷酸二氢铝为粘结剂，氧化铝粉末为填料，嵌入纳米氮化铝和纳米二氧化硅粉末，以促进其固化过程，降低其固化张力，提高其粘结剪切强度。芯片与基板的结合强度得到了提高，满足了MIL-STD-8832019.9芯片贴装组装的要求。与同类商用陶瓷密封剂相比，其包覆性能得到了改善，裂纹较少。在500℃下测试的贴片材料和封装性能显示没有缺陷或额外的裂缝。对样品进行了热老化和热循环。X射线光电子能谱(XPS)分析表明，添加10%纳米二氧化硅的陶瓷样品比不含纳米二氧化硅的样品具有更高的氧键合率。10%纳米二氧化硅陶瓷的X射线衍射峰展宽最大，表明其微晶尺寸较小。对于10%的纳米二氧化硅样品，较小的微晶尺寸为氧化铝晶体结构带来了较大的微应变。FTIR显示这些样品上存在铝硅酸键，其中10%的纳米二氧化硅样品中铝硅酸键的含量最大。傅立叶变换红外光谱分析表明，纳米二氧化硅样品特别是大于10%的纳米二氧化硅样品有Si-O和Al-O键的存在。扫描电子显微镜和能量色散X射线(EDX)结果表明，10%的样品键线均匀，材料分布均匀。
Alumina-based die-attach and encapsulation for high-temperature (300-500 degrees C) electronic packaging were investigated. The alumina paste material comprises aluminum dihydric phosphate as a binder and alumina powder as a filler with embedded nano-aluminum nitride and nanosilica powders to promote its curing process, reduce its curing tension, and increase its bond shear strength. The chip-to-substrate bond strength was enhanced and met the MIL-STD-883 2019.9 requirements for die-attach assembly. Its encapsulation property was improved with fewer cracks compared to similar commercial ceramic encapsulants. The die-attach material and encapsulation properties tested at 500 degrees C showed no defect or additional cracks. Thermal aging and thermal cycling were carried out on the samples. X-ray photo-electron spectroscopy (XPS) analysis revealed a higher oxygen bonding percentage for the 10% nanosilica ceramic sample than the samples with no nanosilica. XRD peak broadening is largest for the 10% nanosilica ceramic, which indicated smaller crystallite sizes. The smaller crystallite size for the 10% nanosilica sample introduces a larger microstrain to the alumina crystal structure. FTIR revealed the presence of alumina-silicate bonds on these samples with the largest amount present in the 10% nanosilica samples. Si-O and Al-O bonds were observed from FTIR on nanosilica samples especially the higher than 10% nanosilica samples. SEM and energy dispersive X-ray (EDX) results showed a uniform bond line for the 10% sample and uniform material distribution.