Possibility of employing thermal stresses as a cutting device for brittle materials.
Possibility of employing thermal stresses as a cutting device for brittle materials.
复制标题
利用热应力作为脆性材料切割装置的可能性。
DOI：
10.1299/kikaia.55.147
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发表时间：
1989
期刊：
影响因子：
--
通讯作者：
Hiroyuki Koga
中科院分区：
文献类型：
--
作者：
Y. Imai;H. Morita;Tooru Takase;Hiroyuki Koga
本文分析了在裂纹尖端有一点热源的无限大平板上，与瞬态温度场有关的半无限大裂纹尖端的时变热应力奇异性。当加热开始时，模式I奇异性随时间逐渐增加，但在显示其最大值后，降低为负值。这种奇异性变化导致裂纹在某些情况下开始增长，但很快就停止了。也就是说，可以控制裂纹生长，这对于用于脆性材料的切割装置是期望的。加热点偏离裂纹线会导致应力奇异性，这也会导致裂纹偏离原裂纹线。在使用玻璃板的实验中，只要加热位置保持适当地远离裂纹尖端，就成功地控制了裂纹以任何角度向热源生长和分支。
Time-dependent thermal stress singularities at a semi-infinite crack tip associated with a transient temperature field have been analyzed on an infinite plate with a point heat source near the crack tip. As the heating begins, a mode I singularity increases gradually with time, but, after showing its maximum, decreases to be negative. This singularity variation causes a crack to start growing at some instance, but soon after to stop. That is, crack growth may be controlled, which is desirable for a cutting device for brittle materials. Deflection of a heating point from a crack line results in a mode II stress singularity, which also leads a crack to swerve from the original crack line. In an experiment using glass plates, a crack was successfully controlled to grow and also to branch in any angle toward the heat source as long as the heating location was kept appropriately apart from the crack tip.