Indentation-induced debonding of ductile films
Indentation-induced debonding of ductile films
复制标题
压痕引起的延展性薄膜脱粘
DOI：
10.1557/proc-586-255
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发表时间：
1999
期刊：
影响因子：
--
通讯作者：
W. Gerberich
中科院分区：
文献类型：
--
作者：
A. Volinsky;W. M. Clift;N. Moody;W. Gerberich
利用纳米压痕技术[1]可以测量薄膜的附着力。在韧性薄膜（Cu, Al， Au等）与脆性基底良好粘附的情况下，薄膜中的塑性变形作为能量耗散机制，防止薄膜脱落。在感兴趣的薄膜上沉积一层脆性的W（约1微米厚），增加了分层的驱动力，从而解决了[2]问题。压痕产生圆形分层（水泡），有时比压痕接触半径大两个数量级。薄膜的粘附力与薄膜厚度成正比，厚度小于100 nm的Cu薄膜的粘附力接近0.8 J/ m2。从概念上讲，在水疱形成过程中，了解裂缝沿哪个界面发生是很重要的。俄歇电子能谱（AES）已被用于确定不同薄膜系统的断裂位置。Cu膜沿Cu/ sio2界面失效。铜膜沿Ti/Cu界面发生了10 nm促附Ti下层的断裂。显著地，Ti将薄Cu膜的附着力提高了10倍。去除基体上的水泡，并对断口表面进行分析。在薄Cu薄膜的情况下，在去除水泡后发现裂纹止裂（基准）标记，并代表裂纹尖端[4]的形状。AFM已被用来确定标记的几何形状。阻滞标记的主要成分是碳，它要么来自金刚石尖端，要么来自压痕过程中吸附在新形成表面上的碳氢化合物。
Thin film adhesion can be measured by means of the nanoindentation technique [1]. In the case of a ductile film (Cu, Al, Au, etc.) well adhered to a brittle substrate, plastic deformation in the film acts as an energy dissipation mechanism, preventing film debonding. Depositing a brittle layer of W (about 1 micron thick) on top of the film of interest increases the driving force for delamination, thus solving the problem [2]. Indentation produces circular delaminations (blisters), sometimes two orders of magnitude bigger than the indenter contact radius. Thin film adhesion was shown to scale with the film thickness, approaching the true work of adhesion of 0.8 J/m 2 for Cu films less than 100 nm thick [3]. Conceptually it is important to know along what interface the fracture occurs during the blister formation. Auger electron spectroscopy (AES) has been used to determine where fracture occurs for different film systems. Cu films on SiO 2 failed along the Cu/SiO 2 interface. Fracture of Cu films with a 10 nm adhesion-promoting Ti underlayer occurred along the Ti/Cu interface. Significantly, Ti increased the thin Cu film adhesion by a factor of ten. Blisters were removed from the substrate, and the fracture surface was analyzed. In the case of thin Cu films, crack arrest (fiducial) marks were found upon blister removal, and represent the shape of the crack tip [4]. AFM has been used to determine the geometry of the marks. The main component of the arrest marks is carbon, which comes either from the diamond tip or from the hydrocarbons adsorbed on the newly formed surfaces in the indentation process.