Electrical conductivity and tensile properties of severely cold-worked Cu-P based alloy sheets
Electrical conductivity and tensile properties of severely cold-worked Cu-P based alloy sheets
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DOI：
10.1007/s12540-010-0821-1
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发表时间：
2010-08
影响因子：
3.5
通讯作者：
J. Kim;J. Park;K. T. Kim
中科院分区：
文献类型：
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作者：
J. Kim;J. Park;K. T. Kim
随着终轧量的增加，Cu-P基合金的电导率呈下降趋势，而抗拉强度呈上升趋势。当在极低温度下进行冷轧时，抗拉强度更显著地增加，即使导电性降低的程度通常与普通冷轧工艺中发现的相似。众所周知，应变硬化降低了纯铜和铜合金的导电性;然而，在这项工作中，据报道，减少的程度显然比以前认为的要大。TEM分析表明，在实验合金中形成了各种细小的含磷沉淀物。粗含P沉淀物和Cu基体之间的不稳定界面被假定为负责电导率的显着下降。
The electrical conductivity of Cu-P based sheet alloys tended to decease with increase of the total amount of final cold rolling, while alloy tensile strength proportionally increased. When the cold rolling was carried out at an extremely low temperature, the tensile strength was more remarkably increased, even though the degree of reduced conductivity was generally similar to that found in the ordinary cold rolling process. It is well known that strain hardening reduces the electrical conductivity of pure Cu and Cu alloys; however, in this work it is reported that the degree of reduction is apparently larger than previously thought. TEM analysis revealed that various fine P-containing precipitates were formed in the experimental alloys. The unstable interface between the coarse P-containing precipitates and the Cu matrix is postulated to be responsible for the significant drop of conductivity.