Two-layer resist process for printing thick patterns by exploiting a maskless projection exposure system using a liquid-crystal-display panel
Two-layer resist process for printing thick patterns by exploiting a maskless projection exposure system using a liquid-crystal-display panel
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DOI:
10.35848/1347-4065/ab7438
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发表时间:
2020-03
影响因子:
1.5
通讯作者:
T. Horiuchi;Hayato Okiyama;R. Sato;Hiroshi Kobayashi
中科院分区:
文献类型:
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作者:
T. Horiuchi;Hayato Okiyama;R. Sato;Hiroshi Kobayashi
To utilize maskless lithography using a liquid-crystal-display (LCD) panel for printing thick resist patterns, a novel two-layer resist process was developed. In the past research, simple and low-cost maskless exposure system was developed using an LCD panel in place of a reticle. However, commercial LCDs were fabricated not to irradiate short-wavelength light rays for protecting human eyes. Therefore, only thin g-line resists have been applicable for printing patterns. Nevertheless, patterning in 10–100 μm thick resist is frequently required for fabricating fluidic devices, lens arrays, and others. For this reason, a conventional g-line resist was coated on a thick UV resist, and patterns of g-line resist formed using the LCD maskless lithography was used as exposure masks of the bottom layer UV resist. As a result, various test patterns with widths of down to 40 μm and almost vertical side walls were successfully printed in the 70 μm thick UV resist.