Surface modification-assisted bonding of polymer-based microfluidic devices
Surface modification-assisted bonding of polymer-based microfluidic devices
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DOI：
10.1016/j.snb.2009.10.001
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发表时间：
2010-01-07
影响因子：
8.4
通讯作者：
Remcho, Vincent T.
中科院分区：
文献类型：
--
作者：
Tennico, Yolanda H.;Koesdjojo, Myra T.;Remcho, Vincent T.
本文报道了表面改性技术的开发和应用，作为粘合聚合物微流体基底的改进方法。该技术通过等离子体氧化，然后在聚合物表面进行硅烷试剂处理，可以轻松生产完整的微流控芯片。使用扫描电子显微镜 (SEM)、水接触角测量来表征键合芯片。和拉伸强度测量。 SEM 图像显示通道特征的完整性被成功保留。证明了其粘合强度接近溶剂焊接的粘合强度。该技术已成功应用于粘合不同类型的聚合物基材（聚甲基丙烯酸甲酯（PMMA）、无定形聚对苯二甲酸乙二醇酯（APET）、聚碳酸酯（PC）），也适用于粘合硬质聚合物基材与聚二甲基硅氧烷（PDMS）或玻璃。 (C) 2009 Elsevier B.V. 保留所有权利。
This paper reports on the development and application of a surface modification technique as an improved method for bonding polymer microfluidic substrates. This technique readily produced complete microfluidic chips via plasma oxidation followed by silane reagent treatment on the polymer surface. Characterization of the bonded chips was performed using scanning electron microscopy (SEM), water contact angle measurement. and tensile strength measurement. SEM images showed that the integrity of the channel features Was Successfully preserved. A bond strength approaching that of solvent welding was demonstrated. This technique has been successfully applied to bond dissimilar polymer substrates (polymethyl methacrylate (PMMA), amorphous polyethylene rerephthalate (APET), polycarbonate (PC)), and is also applicable to bonding a hard polymer substrate to polydimethylsiloxane (PDMS) or glass. (C) 2009 Elsevier B.V. All rights reserved.