Polymer circuit boards fabricated by ultrasonic hot embossing
Polymer circuit boards fabricated by ultrasonic hot embossing
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DOI：
10.1088/0960-1317/23/7/075028
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发表时间：
2013-06
影响因子：
2.3
通讯作者：
J. Li;C. Gerhardy;W. Schomburg
中科院分区：
文献类型：
--
作者：
J. Li;C. Gerhardy;W. Schomburg
本文提出了一种通过超声波热压印制造的新型聚合物电路板。导电路径是通过将中断部分超声波压花到涂覆在塑料基板上的连续金属层中而产生的，并且所有电子元件都在单个超声波工艺步骤中安装到板上。通过这种工艺，电路板的制造和电子元件的互连都可以在几秒钟内完成。板的总体尺寸由超声波机器的超声波发生器的尺寸决定。作为演示器，多谐振荡器电路由五个电阻器、两个 LED、两个晶体管和两个电容器组成。多谐振荡器测试成功。
In this paper, a novel polymer circuit board fabricated by ultrasonic hot embossing is presented. Conductive paths are generated by ultrasonically embossing interruptions into a continuous metal layer coated onto a plastic substrate, and all electronic components are mounted onto the board in a single ultrasonic process step. With this process both the fabrication of a board and the interconnection of electronic components can be achieved in seconds. Overall dimensions of the board are determined by the size of the sonotrode of the ultrasonic machine. As a demonstrator a multivibrator circuit was built up from five resistors, two LEDs, two transistors and two capacitors. The multivibrator was tested successfully.