Nanometer-Scale Metal Plating Using a Scanning Shear-Force Microscope with an Electrolyte-Filled Micropipette Probe
Nanometer-Scale Metal Plating Using a Scanning Shear-Force Microscope with an Electrolyte-Filled Micropipette Probe
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DOI：
10.1143/jjap.43.4482
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发表时间：
2004-07
影响因子：
1.5
通讯作者：
F. Iwata;Y. Sumiya;A. Sasaki
中科院分区：
文献类型：
--
作者：
F. Iwata;Y. Sumiya;A. Sasaki
我们描述了一种新的局部金属电镀技术，使用扫描探针显微镜和充满电解液的微吸管探针。电极采用填充电解质的微吸管内部的电极线作为阳极，采用硅表面作为阴极。在电极线和表面之间施加直流电压，微吸管探头与表面接近接触时，可以在硅表面电化学沉积纳米级的铜点。可以通过调节沉积时间和电压来控制铜点的尺寸。在剪切力控制下改变探头到表面的距离，通过吸管探头扫描表面，顺序地制作点阵和线条图案。这种局部金属电镀技术可以制造纳米机械和纳米电子等纳米结构。
We describe a novel technique of local metal plating using a scanning probe microscope with a micropipette probe filled with an electrolyte solution. An electrode wire inside the electrolyte-filled micropipette and Si surfaces were employed as the anode and the cathode, respectively. Nanometer-scale Cu dots could be electrochemically deposited on the Si surfaces as the micropipette probe was nearly in contact with the surfaces with application of a dc voltage between the electrode wire and the surfaces. It was possible to control the size of the Cu dots by adjusting the deposition time and voltage. Dot arrays and line patterns were sequentially fabricated as the pipette probe scanned the surfaces while changing the probe-to-surface distance under shear-force control. This technique of local metal plating could allow the fabrication of nanostructures such as nanomachines and nanoelectronics.