Rapid 3D Printing of Nanoporous Copper Powders via Micro-Clip
Rapid 3D Printing of Nanoporous Copper Powders via Micro-Clip
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通过微夹快速 3D 打印纳米孔铜粉
DOI：
10.1115/msec2023-104610
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发表时间：
2023
期刊：
影响因子：
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通讯作者：
Chen, Xiangfan
中科院分区：
文献类型：
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作者：
Liu, Luyang;Kublik, Natalya;Azeredo, Bruno;Chen, Xiangfan
通过粉末床熔融、材料挤出和还原光聚合的金属部件的三维（3D）打印一直吸引着人们的兴趣。特别地，基于挤出和基于光聚合的方法采用金属颗粒增强的聚合物基质复合材料（PMC）作为原材料。然而，基于挤出的打印的分辨率受到速度-准确性权衡的限制。相比之下，基于光聚合的工艺可以显著提高印刷分辨率，但由于对原材料流变性能的严格要求，PMC的填料负载通常较低。在此，我们开发了一种新的金属3D打印策略，通过利用微连续液体界面打印（μCLIP）来打印包含纳米多孔铜（NP-Cu）粉末的PMC树脂。通过平衡对更高填料负载的需求和对流变性能的要求以实现μCLIP的印刷适性，对PMC树脂的组成进行了优化。具体而言，NP-Cu粉末在树脂中的浓度可高达40wt%，而不会牺牲印刷适性和印刷速度（10 μm·s-1）。烧结后，可以实现具有微尺度特征（直径470 ± 140 μm）的3D铜结构，其平均电阻率为150 kΩ·mm。总之，这种新策略可能有利于以更快的速度实现更高分辨率的金属部件快速原型制作。
Three-dimensional (3D) printing of metal components through powder bed fusion, material extrusion, and vat photopolymerization, has attracted interest continuously. Particularly, extrusion-based and photopolymerization-based processes employ metal particle-reinforced polymer matrix composites (PMCs) as raw materials. However, the resolution for extrusion-based printing is limited by the speed-accuracy tradeoff. In contrast, photopolymerization-based processes can significantly improve the printing resolution, but the filler loading of the PMC is typically low due to the critical requirement on raw materials’ rheological properties. Herein, we develop a new metal 3D printing strategy by utilizing micro-continuous liquid interface printing (μCLIP) to print PMC resins comprising nanoporous copper (NP-Cu) powders. By balancing the need for higher filler loading and the requirements on rheological properties to enable printability for the μCLIP, the compositions of PMC resin were optimized. In detail, the concentration of the NP-Cu powders in the resins can reach up to 40 wt% without sacrificing the printability and printing speed (10 μm·s−1). After sintering, 3D copper structures with microscale features (470 ± 140 μm in diameter) manifesting an average resistivity of 150 kΩ·mm can be realized. In summary, this new strategy potentially benefits the rapid prototyping of metal components with higher resolution at faster speeds.