Effect of thermal coarsening on the thermal conductivity of nanoporous gold
Effect of thermal coarsening on the thermal conductivity of nanoporous gold
复制标题
热粗化对纳米多孔金导热系数的影响
DOI：
10.1007/s10853-012-6377-3
复制
发表时间：
2012-06-01
影响因子：
4.5
通讯作者：
Chen, Yunfei
中科院分区：
文献类型：
--
作者：
Wang, Jianli;Xia, Re;Chen, Yunfei
在100 ~ 320 K温度范围内测量了不同温度退火后的纳米多孔金（NPG）微丝的热导率。考虑到电子与表面的散射，热导率随韧带直径的增大而增大。然而，NPG微丝的热导率被发现热粗化后下降，并有一个最大值在250 K左右的脱合金样品。我们认为，在相对较高的温度下的缺陷积累和缺陷间距的减少可能导致这些温度行为的热导率。考虑到电子在韧带表面和缺陷上的散射，提出了一个修正的纳米多孔金属热导率的理论模型，与我们的实验结果相一致。
The thermal conductivities of nanoporous gold (NPG) microwires annealed at different temperatures have been measured in the temperature range from 100 to 320 K. Considering the electron-surface scattering, the thermal conductivity is expected to increase with the increase of ligament diameter. However, the thermal conductivity of NPG microwire is found to decrease after thermal coarsening, and has a maximum value at around 250 K for the as-dealloyed sample. We suggest that the defects accumulating at a relatively high temperature and the reduction in defect spacing may cause these temperature behaviors of thermal conductivity. Taking into account the electron scattering on ligament surfaces and defects, a modified theoretical model for the thermal conductivity of nanoporous metal is proposed to agree with our experimental results.