Precise etching of fused silica for refractive and diffractive micro-optical applications
Precise etching of fused silica for refractive and diffractive micro-optical applications
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用于折射和衍射微光学应用的熔融石英的精确蚀刻
DOI：
10.1016/j.optlaseng.2004.12.003
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发表时间：
2005
期刊：
影响因子：
--
通讯作者：
R. Böhme
中科院分区：
文献类型：
--
作者：
K. Zimmer;R. Böhme
当前激光材料加工的挑战之一是用于微光学应用的透明材料的高质量蚀刻。用紫外、超短脉冲甚至紫外激光烧蚀透明材料具有高蚀刻速率和高激光通量的特点，并引起相当大的表面粗糙度变化。特定的激光加工技术，如扫描轮廓掩模技术和小激光光斑直接写入，与激光诱导背面湿蚀刻（LIBWE）相结合，可以直接加工具有几乎光学质量的介电材料，用于制造衍射和折射的地形特征。介绍了多层元件、可变深度光栅、微透镜以及pv值从约100nm到几微米不等的自由曲面形貌的蚀刻，纳米深度精度和rms小于10nm的低粗糙度，并展示了该方法在精密工程中的能力。
One of the challenges of current laser material processing is the high-quality etching of transparent materials for micro-optical applications. The ablation of transparent materials with UV-, ultrashort pulse and even of VUV-lasers is characterized by a high etch rate and a high laser fluence and causes considerable surface roughness evolution. The combination of specific laser processing techniques, e.g., scanning contour mask technique and direct writing with a small laser spot, with laser-induced backside wet etching (LIBWE) allows the direct machining of dielectric materials with an almost optical quality for the fabrication of diffractive as well as refractive topographic features. The etching of multi-level elements, gratings with variable depth, micro-lenses as well as free-form surface topographies with PV-values from some 100nm to a few micrometers, a nanometer depth accuracy and a low roughness of less than 10nm rms is presented and demonstrates the capabilities of this approach for precision engineering.